Key Features
PCBA Manufacturing capability
•Board Size
→255mm x 460mm max
•Through Hole
→Automated Pin Through Hole Assembly
→Hand soldering
→Wave soldering
•R、C、L
→0402 / 0201
→QFP
→Min IC Pitch: 0.3mm
→CSP
→BGA & uBGA
→Ball Pitch: 0.45mm (min)
→Ball diameter: 0.3mm (min)
•Singled-sided, Double-sided, Multilayer boards
•Lead free soldering process (Card,Memory boards)
